Position: Mid-Senior level

Job type: Contract

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Job content

Assembly Support Engineer

Support & coordinate assembly engineering related activities to suppliers/subcontractors to make sure that assembled devices will have no issue and is delivered in time.

The assignment

  • Lead the development and implementation of flipchip, wire bonding, and SMT assembly processes to meet quality, cost, and delivery targets.
  • Collaborate with cross-functional teams, including R&D, Manufacturing, and Quality Assurance, to drive new product and resolve assembly-related issues.
  • Conduct process characterization and optimization studies to improve yield, efficiency, and reliability.
  • Provide technical expertise and guidance on assembly processes.
  • Maintain documentation, including work instructions, and process specifications

Required knowledge and skills

  • Minimum 5 years of experience in assembly engineering, with a focus on flipchip, wire bonding, and SMT processes in a semiconductor or electronics manufacturing environment.
  • Proficiency in using assembly equipment such as wire bonders, flip chip bonders, and SMT placement machines.
  • Strong understanding of assembly materials, including solder, adhesives, and underfills.
  • Experience with statistical analysis tools and methodologies for process optimization (e.g., Design of Experiments, Statistical Process Control).
  • Excellent problem-solving skills and the ability to troubleshoot complex assembly issues.
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Deadline: 29-12-2025

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